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| White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Package: * 208 Plastic Ball Grid Array (PBGA), 16 x 20mm * 1.0mm pitch DDR2 Data Rate = 667*, 533, 400 Supply Voltage = 1.8V 0.1V Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Four internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh Modes On Die Termination (ODT) Adjustable data - output drive strength Programmable CAS latency: 3, 4 or 5 Posted CAS additive latency: 0, 1, 2, 3 or 4 * This product is under development, is not qualified or characterized and is subject to change or cancellation without notice. Write latency = Read latency - 1* tCK Commercial, Industrial and Military Temperature Ranges Organized as 32M x 64, user configurable as 2 x 32M x 32 Weight: W3H32M64E-XSBX - 2.5 grams typical BENEFITS 62% SPACE SAVINGS vs. FPBGA Reduced part count 42% I/O reduction vs FPBGA Reduced trace lengths for lower parasitic capacitance Suitable for hi-reliability applications Upgradeable to 64M x 64 density (contact factory for information) FIGURE 1 - DENSITY COMPARISONS Actual Size W3H32M64E-XSBX 11.0 White Electronic Designs W3H32M64E-XSBX CSP Approach (mm) 11.0 11.0 11.0 19.0 90 FBGA 90 FBGA 90 FBGA 90 FBGA 20 16 S A V I N G S 62% 42% Area I/O Count 4 x 209mm2 = 836mm2 4 x 90 balls = 360 balls 320mm2 208 Balls White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 1 White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com White Electronic Designs W3H32M64E-XSBX ADVANCED FIGURE 2 - FUNCTIONAL BLOCK DIAGRAM WEA# RASA# CASA# CSA# WE# RAS# CAS# CS# ODT A0-12 BA0-1 CK0 CK0# CKEA LDM0 UDM0 LDQS0 LDQS0# UDQS0 UDQS0# CDT A0-12 BA0-1 CK CK# CKE LDM UDM LDQS LDQS# UDQS UDQS# IC1 DQ0 DQ15 DQ0 DQ15 WE# RAS# CAS# CS# CK1 CK1# LDM1 UDM1 LDQS1 LDQS1# UDQS1 UDQS1# ODT A0-12 BA0-1 CK CK# CKE LDM UDM LDQS LDQS# UDQS UDQS# IC2 DQ0 DQ15 DQ16 DQ31 WEB# RASB# CASB# CSB# WE# RAS# CAS# CS# CK2 CK2# CKEB LDM2 UDM2 LDQS2 LDQS2# UDQS2 UDQS2# ODT A0-12 BA0-1 CK CK# CKE LDM UDM LDQS LDQS# UDQS UDQS# IC3 DQ0 DQ15 DQ32 DQ47 WE# RAS# CAS# CS# CK3 CK3# LDM3 UDM3 LDQS3 LDQS3# UDQS3 UDQS3# ODT A0-12 BA0-1 CK CK# CKE LDM UDM LDQS LDQS# UDQS UDQS# IC4 DQ0 DQ15 DQ48 DQ63 White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 2 White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com White Electronic Designs FIGURE 1 - PIN CONFIGURATION TOP VIEW W3H32M64E-XSBX ADVANCED 1 A B C D E F G H J K L M N P R T U V W VCC 2 VCC 3 VSS 4 VCC 5 VCC 6 VSS 7 VCC 8 VCC 9 VSS 10 11 VCC VSS VSS NC NC NC NC CSB# NC NC VSS VCC VSS NC NC NC NC CASB# RASB# DQ34 CK3 CK3# VSS DQ35 DQ51 WEB# CKEB NC NC DQ50 DQ53 DQ37 CK2# CK2 DQ52 DQ36 DQ33 NC DNU DNU DQ39 LDQS2 LDQS3 DQ48 DQ32 LDM3 LDM2 DQ49 DQ43 DQ59 DNU DQ55 DQ58 DQ42 LDQS2# LDQS3# DQ38 DQ54 DQ60 DQ57 UMD2 VSS DQ63 DQ56 DQ40 DQ61 DQ45 UMD3 DQ44 DQ41 DQ46 DQ62 VCC UDQS2# DQ47 UDQS2 UDQS3 UDQS3# VCC A6 A10 A9 VCC VSS VCC A3 A12 DNU* VCC VSS A0 A11 VCC VSS VREF VSS VCC A1 BA1 VSS VCC A2 A4 A8 VCC VSS VCC BA0 A5 A7 VCC UDQS1# UDQS1 UDQS0 DQ15 UDQS0# VCC DQ30 DQ14 DQ9 DQ12 UMD1 DQ13 DQ29 DQ8 DQ24 DQ31 VSS UDM0 DQ25 DQ28 DQ22 DQ6 LDQS1# LDQS0# DQ10 DQ26 DQ23 ODT DQ27 DQ11 DQ17 LDM0 LDM1 DQ0 DQ16 LDQS1 LDQS0 DQ7 NC NC NC DQ1 DQ4 DQ20 CK0 CK0# DQ5 DQ21 DQ18 NC NC CKEA WEA# DQ19 DQ3 VSS CK1# CK1 DQ2 RASA# CASA# NC NC NC NC VSS VCC VSS NC NC CSA# NC NC NC NC VSS VCC VSS VCC VSS VCC VCC VSS VCC VCC VSS VCC VSS * Pin J10 is reserved for signal A13 on future upgrades. White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 3 White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com White Electronic Designs W3H32M64E-XSBX ADVANCED PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA) BOTTOM VIEW 208 x O 0.60 (0.024) NOM 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G 20.15 (0.793) MAX 18.0 (0.709) NOM H J K L M 1.0 (0.039) NOM N P R T U V W 1.0 (0.039)NOM 0.50 (0.020) NOM 10.0 (0.394) NOM 16.15 (0.636) MAX 2.56 (0.100) MAX All linear dimensions are millimeters and parenthetically in inches White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 4 White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com White Electronic Designs ORDERING INFORMATION W3H32M64E-XSBX ADVANCED W 3H 32M 64 E - XXX SB X WHITE ELECTRONIC DESIGNS CORP. DDR2 SDRAM CONFIGURATION, 32M x 64 1.8V Power Supply DATA RATE (Mbs) 400 = 400Mbs 533 = 533Mbs 667 = 667Mbs Blank = No datarate specified for ES product (1) PACKAGE: ES = Non Qualified Product (1) SB = 208 Plastic Ball Grid Array (PBGA) DEVICE GRADE: M = Military -55C to +125C I = Industrial -40C to +85C C = Commercial 0C to +70C Blank = No temperature specified for ES product (1) Note 1: W3H32M64E-ESSB is the only available product until completion of qualification. White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 5 White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com White Electronic Designs Document Title 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package W3H32M64E-XSBX ADVANCED Revision History Rev # Rev 0 Rev 1 History Initial Release Changes (Pg. 1, 3, 5) 1.1 Change max package width to 16mm Release Date June 2005 August 2005 Status Advanced Advanced Rev 2 Changes (pg. 1, 3, 6) 2.1 Pinout added October 2005 Advanced Rev 3 Changes (Pg. 1, 3, 6) 3.1 Change all VCCQ to VCC October 2005 Advanced White Electronic Designs Corp. reserves the right to change products or specifications without notice. October 2005 Rev. 3 6 White Electronic Designs Corporation * (602) 437-1520 * www.wedc.com |
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